3D Networks-on-Chip mapping targeting minimum signal TSVs

Hui Ding, Huaxi Gu, Yintang Yang, Dongrui Fan. 3D Networks-on-Chip mapping targeting minimum signal TSVs. IEICE Electronic Express, 10(18):20130518, 2013. [doi]

@article{DingGYF13,
  title = {3D Networks-on-Chip mapping targeting minimum signal TSVs},
  author = {Hui Ding and Huaxi Gu and Yintang Yang and Dongrui Fan},
  year = {2013},
  doi = {10.1587/elex.10.20130518},
  url = {http://dx.doi.org/10.1587/elex.10.20130518},
  researchr = {https://researchr.org/publication/DingGYF13},
  cites = {0},
  citedby = {0},
  journal = {IEICE Electronic Express},
  volume = {10},
  number = {18},
  pages = {20130518},
}