Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study

Hai Ding, I. Charles Ume, Jian Zhang, Daniel F. Baldwin. Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study. IEEE T. Instrumentation and Measurement, 54(5):1898-1904, 2005. [doi]

Abstract

Abstract is missing.