High-throughput interpolation hardware architecture with coarse-grained reconfigurable datapaths for HEVC

Cláudio Machado Diniz, Muhammad Shafique, Sergio Bampi, Jörg Henkel. High-throughput interpolation hardware architecture with coarse-grained reconfigurable datapaths for HEVC. In IEEE International Conference on Image Processing, ICIP 2013, Melbourne, Australia, September 15-18, 2013. pages 2091-2095, IEEE, 2013. [doi]

Abstract

Abstract is missing.