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B. Dompierre, W. C. Maia Filho, M. Brizoux, V. Aubin, E. Charkaluk. Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy. Microelectronics Reliability, 50(9-11):1661-1665, 2010. [doi]
Abstract is missing.