Siwan Dong, Cong Liu, Xin Xin, Xingyuan Tong. A three-stage OTA with hybrid active miller enhanced compensation technique for large to heavy load applications. Microelectronics Journal, 115:105199, 2021. [doi]
@article{DongLXT21,
title = {A three-stage OTA with hybrid active miller enhanced compensation technique for large to heavy load applications},
author = {Siwan Dong and Cong Liu and Xin Xin and Xingyuan Tong},
year = {2021},
doi = {10.1016/j.mejo.2021.105199},
url = {https://doi.org/10.1016/j.mejo.2021.105199},
researchr = {https://researchr.org/publication/DongLXT21},
cites = {0},
citedby = {0},
journal = {Microelectronics Journal},
volume = {115},
pages = {105199},
}