P. Dreher, Roman Schmidt, A. Vetter, J. Hepp, Karl Aberer, C. J. Brabec. Non-destructive imaging of defects in Ag-sinter die attach layers - A comparative study including X-ray, Scanning Acoustic Microscopy and Thermography. Microelectronics Reliability, 88:365-370, 2018. [doi]
Abstract is missing.