W. D. van Driel, M. A. J. van Gils, R. B. R. van Silfhout, G. Q. Zhang. Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectronics Reliability, 45(9-11):1633-1638, 2005. [doi]
@article{DrielGSZ05,
title = {Prediction of Delamination Related IC & Packaging Reliability Problems},
author = {W. D. van Driel and M. A. J. van Gils and R. B. R. van Silfhout and G. Q. Zhang},
year = {2005},
doi = {10.1016/j.microrel.2005.07.065},
url = {http://dx.doi.org/10.1016/j.microrel.2005.07.065},
tags = {reliability},
researchr = {https://researchr.org/publication/DrielGSZ05},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {45},
number = {9-11},
pages = {1633-1638},
}