Prediction of Delamination Related IC & Packaging Reliability Problems

W. D. van Driel, M. A. J. van Gils, R. B. R. van Silfhout, G. Q. Zhang. Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectronics Reliability, 45(9-11):1633-1638, 2005. [doi]

Abstract

Abstract is missing.