Reliability modelling for packages in flexible end-products

W. D. van Driel, O. van der Sluis, D. G. Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang. Reliability modelling for packages in flexible end-products. Microelectronics Reliability, 46(9-11):1880-1885, 2006. [doi]

Abstract

Abstract is missing.