Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue

Rainer Dudek, M. Hildebrand, Sven Rzepka, T. Fries, Ralf Döring, Bettina Seiler, R. W. Ortmann. Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue. Microelectronics Reliability, 83:162-172, 2018. [doi]

Abstract

Abstract is missing.