A Novel Solvent Bonding Method for Creating A 3D, Nonplanar, and Hybrid PLA/PMMA Microfluidic Chip

Lynh Huyen Duong, Pin-Chuan Chen. A Novel Solvent Bonding Method for Creating A 3D, Nonplanar, and Hybrid PLA/PMMA Microfluidic Chip. In 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018, Singapore, Singapore, April 22-26, 2018. pages 177-180, IEEE, 2018. [doi]

Abstract

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