Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling

L. Dupont, Z. Khatir, S. Lefebvre, S. Bontemps. Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. Microelectronics Reliability, 46(9-11):1766-1771, 2006. [doi]

Abstract

Abstract is missing.