The development and evaluation of RF TSV for 3D IPD applications

Thorbjorn Ebefors, Jessica Fredlund, Daniel Perttu, Raymond van Dijk, Lorenzo Cifola, Mikko Kaunisto, Pekka Rantakari, Tauno Vaha-Heikkila. The development and evaluation of RF TSV for 3D IPD applications. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-8, IEEE, 2013. [doi]

@inproceedings{EbeforsFPDCKRV13,
  title = {The development and evaluation of RF TSV for 3D IPD applications},
  author = {Thorbjorn Ebefors and Jessica Fredlund and Daniel Perttu and Raymond van Dijk and Lorenzo Cifola and Mikko Kaunisto and Pekka Rantakari and Tauno Vaha-Heikkila},
  year = {2013},
  doi = {10.1109/3DIC.2013.6702382},
  url = {http://dx.doi.org/10.1109/3DIC.2013.6702382},
  researchr = {https://researchr.org/publication/EbeforsFPDCKRV13},
  cites = {0},
  citedby = {0},
  pages = {1-8},
  booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
  publisher = {IEEE},
}