Ryusuke Egawa, Yusuke Funaya, Ryu-ichi Nagaoka, Akihiro Musa, Hiroyuki Takizawa, Hiroaki Kobayashi. Design and early evaluation of a 3-D die stacked chip multi-vector processor. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-8, IEEE, 2010. [doi]
@inproceedings{EgawaFNMTK10,
title = {Design and early evaluation of a 3-D die stacked chip multi-vector processor},
author = {Ryusuke Egawa and Yusuke Funaya and Ryu-ichi Nagaoka and Akihiro Musa and Hiroyuki Takizawa and Hiroaki Kobayashi},
year = {2010},
doi = {10.1109/3DIC.2010.5751448},
url = {http://dx.doi.org/10.1109/3DIC.2010.5751448},
tags = {design},
researchr = {https://researchr.org/publication/EgawaFNMTK10},
cites = {0},
citedby = {0},
pages = {1-8},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010},
publisher = {IEEE},
}