Ryusuke Egawa, Yusuke Funaya, Ryu-ichi Nagaoka, Akihiro Musa, Hiroyuki Takizawa, Hiroaki Kobayashi. Design and early evaluation of a 3-D die stacked chip multi-vector processor. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-8, IEEE, 2010. [doi]
Abstract is missing.