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Ashkan Eghbal, Pooria M. Yaghini, Nader Bagherzadeh. Capacitive Coupling Mitigation for TSV-based 3D ICs. In 33rd IEEE VLSI Test Symposium, VTS 2015, Napa, CA, USA, April 27-29, 2015. pages 1-6, IEEE, 2015. [doi]