Luke England, Sukeshwar Kannan, Rahul Agarwal, Daniel Smith. Impact of TSV integration on 14nm FinFET device performance. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-5, IEEE, 2016. [doi]
No references recorded for this publication.
No citations of this publication recorded.