Savithra Eratne, Eugene John, Byeong Kil Lee. Reducing thermal hotspots in microprocessors with expanded component sizing. In 55th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2012, Boise, ID, USA, August 5-8, 2012. pages 635-638, IEEE, 2012. [doi]
Abstract is missing.