Prolog to Wafer Direct Bonding: From Advance Substrate Engineering to Future Applications in Micro/Nanoelectronics

Jim Esch. Prolog to Wafer Direct Bonding: From Advance Substrate Engineering to Future Applications in Micro/Nanoelectronics. Proceedings of the IEEE, 94(12):2058-2059, 2006. [doi]

Authors

Jim Esch

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