Shu-Kai S. Fan, Chun-Wei Cheng, Du-Ming Tsai. Fault Diagnosis of Wafer Acceptance Test and Chip Probing Between Front-End-of-Line and Back-End-of-Line Processes. IEEE T. Automation Science and Engineering, 19(4):3068-3082, 2022. [doi]
@article{FanCT22,
title = {Fault Diagnosis of Wafer Acceptance Test and Chip Probing Between Front-End-of-Line and Back-End-of-Line Processes},
author = {Shu-Kai S. Fan and Chun-Wei Cheng and Du-Ming Tsai},
year = {2022},
doi = {10.1109/TASE.2021.3106011},
url = {https://doi.org/10.1109/TASE.2021.3106011},
researchr = {https://researchr.org/publication/FanCT22},
cites = {0},
citedby = {0},
journal = {IEEE T. Automation Science and Engineering},
volume = {19},
number = {4},
pages = {3068-3082},
}