Fault Diagnosis of Wafer Acceptance Test and Chip Probing Between Front-End-of-Line and Back-End-of-Line Processes - researchr publication

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Shu-Kai S. Fan, Chun-Wei Cheng, Du-Ming Tsai. Fault Diagnosis of Wafer Acceptance Test and Chip Probing Between Front-End-of-Line and Back-End-of-Line Processes. IEEE T. Automation Science and Engineering, 19(4):3068-3082, 2022. [doi]

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