Key Feature Identification for Monitoring Wafer-to-Wafer Variation in Semiconductor Manufacturing

Shu-Kai S. Fan, Chia-Yu Hsu, Du-Ming Tsai, Mabel C. Chou, Chih-Hung Jen, Jen-Hsuan Tsou. Key Feature Identification for Monitoring Wafer-to-Wafer Variation in Semiconductor Manufacturing. IEEE T. Automation Science and Engineering, 19(3):1530-1541, 2022. [doi]

@article{FanHTCJT22,
  title = {Key Feature Identification for Monitoring Wafer-to-Wafer Variation in Semiconductor Manufacturing},
  author = {Shu-Kai S. Fan and Chia-Yu Hsu and Du-Ming Tsai and Mabel C. Chou and Chih-Hung Jen and Jen-Hsuan Tsou},
  year = {2022},
  doi = {10.1109/TASE.2022.3141426},
  url = {https://doi.org/10.1109/TASE.2022.3141426},
  researchr = {https://researchr.org/publication/FanHTCJT22},
  cites = {0},
  citedby = {0},
  journal = {IEEE T. Automation Science and Engineering},
  volume = {19},
  number = {3},
  pages = {1530-1541},
}