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Optimize Power Module Sintering Methodology for High Thermal Conductivity and Reliability

Jen-Kuang Fang, Jen-Chun Chen, Pai-Sheng Shih, Kuan-Fu Chen. Optimize Power Module Sintering Methodology for High Thermal Conductivity and Reliability. In 2025 5th International Conference on Electrical, Computer and Energy Technologies (ICECET), Paris, France, July 3-6, 2025. pages 1-4, IEEE, 2025. [doi]

Authors

Jen-Kuang Fang

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Jen-Chun Chen

This author has not been identified. Look up 'Jen-Chun Chen' in Google

Pai-Sheng Shih

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Kuan-Fu Chen

This author has not been identified. Look up 'Kuan-Fu Chen' in Google
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