Jen-Kuang Fang, Jen-Chun Chen, Pai-Sheng Shih, Kuan-Fu Chen. Optimize Power Module Sintering Methodology for High Thermal Conductivity and Reliability. In 2025 5th International Conference on Electrical, Computer and Energy Technologies (ICECET), Paris, France, July 3-6, 2025. pages 1-4, IEEE, 2025. [doi]
Abstract is missing.