Hussein Farhat, Ibrahim Mjallal, Mohammad Hammoud, Samer Ali, Ali Al Shaer, Ali Assi, Ibrahim Assi. Investigating the effect of the density of phase change materials on cooling electronic packages. In 29th International Conference on Microelectronics, ICM 2017, Beirut, Lebanon, December 10-13, 2017. pages 1-5, IEEE, 2017. [doi]
Abstract is missing.