Muhammad Salman Al Farisi, Hideki Hirano, Shuji Tanaka. Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps. In 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016, Sendai, Japan, April 17-20, 2016. pages 573-577, IEEE, 2016. [doi]
Abstract is missing.