Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability

M. G. Farooq, G. La Rosa, Fen Chen, P. Periasamy, T. L. Graves-Abe, Chandrasekharan Kothandaraman, C. Collins, W. Landers, J. Oakley, J. Liu, John Safran, S. Ghosh, S. Mittl, D. Ioannou, Carole Graas, D. Berger, Subramanian S. Iyer. Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability. In IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015. pages 4, IEEE, 2015. [doi]

Abstract

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