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Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis

Joseph Favata, Sina Shahbazmohamadi. Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis. Microelectronics Reliability, 83:91-100, 2018. [doi]

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