Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 degreeC

L. Feller, S. Hartmann, D. Schneider. Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 degreeC. Microelectronics Reliability, 48(8-9):1161-1166, 2008. [doi]

Abstract

Abstract is missing.