Fabrication and stress analysis of annular-trench-isolated TSV

Wei Feng, Bui Thanh Tung, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi. Fabrication and stress analysis of annular-trench-isolated TSV. Microelectronics Reliability, 63:142-147, 2016. [doi]

Abstract

Abstract is missing.