Yinxiao Feng, Dong Xiang, Kaisheng Ma. Heterogeneous Die-to-Die Interfaces: Enabling More Flexible Chiplet Interconnection Systems. In Proceedings of the 56th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2023, Toronto, ON, Canada, 28 October 2023 - 1 November 2023. pages 930-943, ACM, 2023. [doi]
Abstract is missing.