Torsion test applied for reballing and solder paste volume evaluation

W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto. Torsion test applied for reballing and solder paste volume evaluation. Microelectronics Reliability, 47(9-11):1663-1667, 2007. [doi]

Abstract

Abstract is missing.