Andrew J. Fleming, Yuen Kuan Yong. Thermal analysis of piezoelectric benders with laminated power electronics. In 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, Wollongong, Australia, July 9-12, 2013. pages 83-88, IEEE, 2013. [doi]
@inproceedings{FlemingY13, title = {Thermal analysis of piezoelectric benders with laminated power electronics}, author = {Andrew J. Fleming and Yuen Kuan Yong}, year = {2013}, doi = {10.1109/AIM.2013.6584072}, url = {https://doi.org/10.1109/AIM.2013.6584072}, researchr = {https://researchr.org/publication/FlemingY13}, cites = {0}, citedby = {0}, pages = {83-88}, booktitle = {2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, Wollongong, Australia, July 9-12, 2013}, publisher = {IEEE}, isbn = {978-1-4673-5319-9}, }