Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak. A high-speed design methodology for inductive coupling links in 3D-ICs. In 2018 Design, Automation & Test in Europe Conference & Exhibition, DATE 2018, Dresden, Germany, March 19-23, 2018. pages 497-502, IEEE, 2018. [doi]
@inproceedings{FletcherDM18, title = {A high-speed design methodology for inductive coupling links in 3D-ICs}, author = {Benjamin J. Fletcher and Shidhartha Das and Terrence S. T. Mak}, year = {2018}, doi = {10.23919/DATE.2018.8342059}, url = {https://doi.org/10.23919/DATE.2018.8342059}, researchr = {https://researchr.org/publication/FletcherDM18}, cites = {0}, citedby = {0}, pages = {497-502}, booktitle = {2018 Design, Automation & Test in Europe Conference & Exhibition, DATE 2018, Dresden, Germany, March 19-23, 2018}, publisher = {IEEE}, isbn = {978-3-9819263-0-9}, }