Paul D. Franzon, Avi Bar-Cohen. Thermal requirements in future 3D processors. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-6, IEEE, 2013. [doi]
@inproceedings{FranzonB13,
title = {Thermal requirements in future 3D processors},
author = {Paul D. Franzon and Avi Bar-Cohen},
year = {2013},
doi = {10.1109/3DIC.2013.6702402},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702402},
researchr = {https://researchr.org/publication/FranzonB13},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}