Masahisa Fujino, Ikuo Soga, Daiyu Kondo, Yoshikatsu Ishizuki, Taisuke Iwai, Tadatomo Suga. Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer. Microelectronics Reliability, 55(12):2560-2564, 2015. [doi]
Abstract is missing.