Takafumi Fukushima, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi. Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-5, IEEE, 2010. [doi]
Abstract is missing.