Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi. Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines, 2(1):49-68, 2011. [doi]
@article{FukushimaKIKKMBLTK11,
title = {Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration},
author = {Takafumi Fukushima and Takayuki Konno and Eiji Iwata and Risato Kobayashi and Toshiya Kojima and Mariappan Murugesan and Ji Chel Bea and Kang-Wook Lee and Tetsu Tanaka and Mitsumasa Koyanagi},
year = {2011},
doi = {10.3390/mi2010049},
url = {http://dx.doi.org/10.3390/mi2010049},
researchr = {https://researchr.org/publication/FukushimaKIKKMBLTK11},
cites = {0},
citedby = {0},
journal = {Micromachines},
volume = {2},
number = {1},
pages = {49-68},
}