Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi. Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines, 2(1):49-68, 2011. [doi]
Abstract is missing.