Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi. New concept of TSV formation methodology using Directed Self-Assembly (DSA). In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]
@inproceedings{FukushimaMOHBLT16,
title = {New concept of TSV formation methodology using Directed Self-Assembly (DSA)},
author = {Takafumi Fukushima and Mariappan Murugesan and Shin Ohsaki and Hiroyuki Hashimoto and Jichoel Bea and Kang-Wook Lee and Tetsu Tanaka and Mitsumasa Koyanagi},
year = {2016},
doi = {10.1109/3DIC.2016.7970022},
url = {https://doi.org/10.1109/3DIC.2016.7970022},
researchr = {https://researchr.org/publication/FukushimaMOHBLT16},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016},
publisher = {IEEE},
isbn = {978-1-5090-1399-9},
}