Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration - researchr publication authors

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Markus Gabriel, Thomas Knauer, Peter Bisson, Sumant Sood, Wilfried Bair, Jim Hermanowski. Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-5, IEEE, 2010. [doi]

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