Markus Gabriel, Thomas Knauer, Peter Bisson, Sumant Sood, Wilfried Bair, Jim Hermanowski. Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-5, IEEE, 2010. [doi]
@inproceedings{GabrielKBSBH10,
title = {Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration},
author = {Markus Gabriel and Thomas Knauer and Peter Bisson and Sumant Sood and Wilfried Bair and Jim Hermanowski},
year = {2010},
doi = {10.1109/3DIC.2010.5751478},
url = {http://dx.doi.org/10.1109/3DIC.2010.5751478},
researchr = {https://researchr.org/publication/GabrielKBSBH10},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010},
publisher = {IEEE},
}