Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung. 2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads. Microelectronics Reliability, 51(12):2306-2313, 2011. [doi]
@article{GainCY11a,
title = {2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads},
author = {Asit Kumar Gain and Y. C. Chan and Winco K. C. Yung},
year = {2011},
doi = {10.1016/j.microrel.2011.03.042},
url = {http://dx.doi.org/10.1016/j.microrel.2011.03.042},
researchr = {https://researchr.org/publication/GainCY11a},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {51},
number = {12},
pages = {2306-2313},
}