2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads

Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung. 2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads. Microelectronics Reliability, 51(12):2306-2313, 2011. [doi]

Abstract

Abstract is missing.