Mechanical properties versus temperature relation of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy

Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto, Jianmin Qu. Mechanical properties versus temperature relation of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy. Microelectronics Reliability, 49(3):296-302, 2009. [doi]

Abstract

Abstract is missing.