Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon. Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-4, IEEE, 2010. [doi]
@inproceedings{GaudinRLTRSWKH10,
title = {Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment},
author = {Gweltaz Gaudin and Gregory Riou and Didier Landru and Catherine Tempesta and Ionut Radu and Mariam Sadaka and Kevin Winstel and Emily Kinser and Robert Hannon},
year = {2010},
doi = {10.1109/3DIC.2010.5751472},
url = {http://dx.doi.org/10.1109/3DIC.2010.5751472},
researchr = {https://researchr.org/publication/GaudinRLTRSWKH10},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010},
publisher = {IEEE},
}