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Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment

Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon. Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-4, IEEE, 2010. [doi]

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