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TSV repairing for 3D ICs using redundant TSV

Sudeep Ghosh, Surajit Kumar Roy, Hafizur Rahaman, Chandan Giri. TSV repairing for 3D ICs using redundant TSV. In 7th International Symposium on Embedded Computing and System Design, ISED 2017, Durgapur, India, December 18-20, 2017. pages 1-5, IEEE, 2017. [doi]

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