Integration of CNT in TSV (≤5 μm) for 3D IC application and its process challenges - researchr publication authors

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K. Ghosh, C. C. Yap, B. K. Tay, C. S. Tan. Integration of CNT in TSV (≤5 μm) for 3D IC application and its process challenges. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]

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