M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, R. B. R. van Silfhout, X. J. Fan, J. H. J. Janssen. Virtual qualification of moisture induced failures of advanced packages. Microelectronics Reliability, 47(2-3):273-279, 2007. [doi]
@article{GilsDZBSFJ07,
title = {Virtual qualification of moisture induced failures of advanced packages},
author = {M. A. J. van Gils and W. D. van Driel and G. Q. Zhang and H. J. L. Bressers and R. B. R. van Silfhout and X. J. Fan and J. H. J. Janssen},
year = {2007},
doi = {10.1016/j.microrel.2006.09.011},
url = {http://dx.doi.org/10.1016/j.microrel.2006.09.011},
researchr = {https://researchr.org/publication/GilsDZBSFJ07},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {2-3},
pages = {273-279},
}